Management TeamAkros Silicon Inc. was founded in January 2005 by a team of seasoned
semiconductor Akros Silicon’s leadership team has extensive experience in building high-growth companies that deliver industry-leading products.
A well-recognized executive and technologist, Lee Stoian has over 35 years of diversified business, management and engineering experience in high-tech start-up companies, as well as large corporations. Most recently, Mr. Stoian served as General Partner of Phoenix Business Partners, a transition management consulting service firm. He also served as Interim CEO of H-Stream Wireless, Inc., a fabless semiconductor start-up focused on wireless PAN market, and Interim CEO of Axiom Microdevices, Inc., a fabless semiconductor start-up focused on cellular telephony market. Prior to this, he served as President and CEO of BitBlitz Communications, Inc. From July 2000 to April 2003, he served as Vice President of Engineering for Intersil Corporation. From March 1997 to July 2000, Mr. Stoian served as President and CEO of SiPCore, Inc., a mixed-signal intellectual solutions provider. Prior to this, Mr. Stoian held various executive, senior technical management and senior technical positions at Arithmos Inc., National Semiconductor Corporation, and Motorola Inc. Mr. Stoian holds an M.S.E.E. degree from the Polytechnic Institute of Bucharest, Romania, and is a graduate of the Executive Marketing Program for Technology-Based Businesses from the University of Western Ontario, Canada. Mr. Stoian serves on the Board of Directors and/or Technical Advisory Board of several fabless semiconductor start-up companies. back to top J. Francois Crepin
Mr. Crepin holds a B.Sc. in Mathematics from Grenoble University and an M.B.A. from the University of Paris. back to top John Camagna
He is a recognized pioneer in the broadband arena for his work at Metalink Ltd., where, as Vice President of Engineering, he directed mixed-signal wire-line AFE and RF IC developments. Prior to that, he directed the DSL program at Level One, creating the industry’s first HDSL2 chipset. Mr. Camagna also held engineering management positions at Crystal Semiconductor/Cirrus Logic and Applied Signal Technology. He holds a B.S. and M.S. with Highest Honors from the University of California at Berkeley. He is the author of 5 patents. back to top
Mr. Ghoshal was previously Chief Operating Officer at Calpont Corp., a development-stage company specializing in hardware database systems, where he was responsible for engineering, operations, worldwide sales, product marketing and applications support. At Calpont, he engaged key alpha development partners such as FedEx, Acxiom, NCR/Teradata and Business Objects. Prior to Calpont, he was Vice President of Engineering of Agere Inc. in Austin, TX. Agere Inc. was acquired by Lucent in 2000. Mr. Ghoshal was instrumental in delivering the industry’s first 2.5/10Gigabit/s Network Processor on TSMC 0.13u process. Before Agere, he worked for 13 years at Level One Communications, where he served as Director of Engineering of the WAN Access Division. Mr. Ghoshal has 21 years of experience and holds an M.S. in Electrical Engineering from the University of Notre Dame. He is the author of 7 patents. back to top |
entrepreneurs,
including J. Francois Crepin (former President, COO and Director
of Metalink, Ltd., a wireline and wireless semiconductor leader),
John Camagna (former Vice President of Engineering at Metalink),
and Sajol Ghoshal (former COO at Calpont, a hardware-based database
management development-stage company).
Mr. Crepin has also served as President, COO and Director of Metalink Ltd. since March 1999. Under his leadership, Metalink completed its IPO in 1999 and a Secondary Offering in March 2000. Prior to that, he held various Vice President positions at Level One Communications Inc., including VP Marketing and Sales, Business Development and M&A as well as Divisional GM. Before that, Mr. Crepin served as Director of Strategic Planning for Information Communications at LSI Logic, and Director of Telecom at National Semiconductor Corp.
Mr. Camagna has extensive experience in IC product development
from vision and inception to mass production for data acquisition,
voice-band processing, wireless communications and telecom. He has
created numerous ICs, has built design engineering organizations
from the ground up, and has created many chips.
Sajol Ghoshal